AMD Taiwan Investment Tops $10 Billion for AI Chips
AMD Taiwan investment backs EFB 2.5D packaging to support Helios rack deployments in 2H 2026 and may prompt supplier and ODM positioning.
KEY TAKEAWAYS
- AMD said it will invest more than $10 billion in Taiwan to scale advanced packaging manufacturing.
- The program aims to industrialize EFB 2.5D packaging with ASE, SPIL and PTI to boost interconnect bandwidth.
- AMD said Helios rack deployments are on track for multi-gigawatt scale beginning in the second half of 2026.
HIGH POTENTIAL TRADES SENT DIRECTLY TO YOUR INBOX
Add your email to receive our free daily newsletter. No spam, unsubscribe anytime.
Advanced Micro Devices Inc. (AMD) said in a press release on May 21, 2026, that its Taiwan investment will industrialize Elevated Fanout Bridge (EFB) 2.5D packaging to support Helios rack-scale deployments starting in the second half of 2026.
Scale and Scope of Investment
AMD described the program as investments across the Taiwan ecosystem to expand strategic partnerships and scale advanced packaging manufacturing for next-generation AI infrastructure. The company said deployments of its Helios rack-scale platform are on track to reach multi-gigawatt scale beginning in the second half of 2026. Original design manufacturers Sanmina, Wiwynn, Wistron, and Inventec will help move Helios systems from design to high-volume production.
Packaging and Product Roadmap
AMD is collaborating with Taiwan-based outsourced semiconductor assembly and test (OSAT) providers ASE Technology and Siliconware Precision Industries (SPIL) to develop and qualify wafer-based EFB 2.5D bridge interconnect technology. The company also highlighted a milestone with Powertech Technology Inc. (PTI), which qualified the industry’s first 2.5D panel-based EFB interconnect. AMD said this panel-based approach supports high-bandwidth interconnect at scale and improves the economics of deploying power-efficient AI systems.
The company described EFB-based 2.5D packaging as a way to increase interconnect bandwidth and improve power efficiency, enabling higher performance per watt under real-world power and cooling constraints. AMD named its 6th-generation EPYC CPU, codenamed “Venice,” and AMD Instinct MI450X GPUs as central to the Helios platform, which will be paired with advanced networking and the ROCm open software stack.
“Working with strategic partners in Taiwan and globally, AMD is advancing leading-edge silicon, packaging and manufacturing technologies that enable higher performance, greater efficiency and faster deployment of AI systems,” the company said.
