Intel Core Ultra Series 3 Debuts At CES 2026

Intel Corp. (INTC) on Jan. 5, 2026 unveiled the Intel Core Ultra Series 3 processors at CES 2026, promoting the platform for broad partner adoption and a phased rollout that will test its manufacturing claims and product availability through mid-2026.

Launch and Availability

Intel introduced the Series 3 processors at CES in Las Vegas, positioning them as its new mobile and AI PC platform. Pre-orders for the first consumer laptops powered by Series 3 began Jan. 6, 2026. Systems will reach global retailers starting Jan. 27, with additional designs rolling out through the first half of the year. Embedded and industrial edge SKUs are scheduled to ship beginning in the second quarter.

Architecture and Strategy

Intel said in a press release that Core Ultra Series 3 is built on Intel 18A, which it describes as the most advanced semiconductor process developed and manufactured in the U.S. The company frames the node as central to reclaiming process leadership and strengthening domestic semiconductor production.

The platform will power more than 200 PC designs from global partners, making it the broadest AI PC platform Intel has delivered. Secondary coverage refers to the generation as “Panther Lake” and links the launch to Intel’s broader foundry expansion, including planned capacity increases at Arizona facilities through 2026.

Intel added Core Ultra X9 and X7 mobile classes with integrated Intel Arc graphics. Top SKUs feature up to 16 CPU cores, 12 Xe cores, and 50 tera operations per second (TOPS) of neural processing unit (NPU) compute. The company highlighted tighter integration of CPU, GPU, and NPU as a key architectural element.

Intel claims the highest-end Series 3 parts deliver up to 60.0% better multithread performance versus the prior Lunar Lake Series 2 generation, more than 77.0% faster gaming performance, and up to 27 hours of battery life. It also positions the single system-on-chip (SoC) design as lowering total cost of ownership compared with multi-chip CPU-plus-GPU configurations for edge AI workloads.

For edge AI, Intel cited up to 1.9 times higher large-language-model performance, up to 2.3 times better performance per watt per dollar on end-to-end video analytics, and up to 4.5 times higher throughput on vision-language-action models. The edge SKUs are certified for industrial use, including extended temperature ranges, deterministic performance, and 24/7 reliability.

On gaming, Intel emphasized a larger integrated GPU based on Intel Arc B390 Xe3 with up to 12 Xe cores. It supports multiframe generation via Intel XeSS 3, citing internal tests such as running Battlefield 6 at 147 frames per second at 1080p with the highest graphics settings. Intel framed Series 3 as bringing desktop-class gaming performance to mobile devices and is working with OEMs including MSI and Acer on a PC gaming handheld platform.

Jim Johnson, senior vice president and general manager of Intel’s Client Computing Group, said, “With Series 3, we are laser focused on improving power efficiency, adding more CPU performance, a bigger GPU in a class of its own, more AI compute and app compatibility you can count on with x86.”

Secondary analysis ties the Series 3 launch to Intel’s foundry ambitions, treating the chips and the use of 18A as a public test of whether Intel can scale leading-edge manufacturing. Analysts note that while product momentum is meaningful, near-term earnings power remains unproven amid competitive pressure from AMD’s client CPU share gains. These factors will influence how investors assess Intel’s manufacturing progress as the chips reach customers.